View TJA105109_4527849.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TJA1051
High-speed CAN transceiver
Rev. 04 -- 20 October 2009 Product data sheet
1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive industry, providing differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJA1051 is a up from the TJA1050 high-speed CAN transceiver. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features:
* Ideal passive behavior to the CAN bus when the supply voltage is off * TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3 V to 5 V These features make the TJA1051 an excellent choice for all types of HS-CAN networks, in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features
2.1 General
I I I I Fully ISO 11898-2 compliant Suitable for 12 V and 24 V systems Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V microcontrollers (available in SO8 and very small HVSON8 packages respectively)
2.2 Low-power management
I Functional behavior predictable under all supply conditions I Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
I I I I I High ElectroStatic Discharge (ESD) handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Undervoltage detection on pins VCC and VIO Thermally protected
NXP Semiconductors
TJA1051
High-speed CAN transceiver
3. Ordering information
Table 1. Ordering information Package Name TJA1051T TJA1051T/3[1] TJA1051TK/3[1] SO8 SO8 HVSON8 Description plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 3.9 mm plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm Version SOT96-1 SOT96-1 SOT782-1 Type number
[1]
TJA1051T/3 and TJA1051TK/3 with VIO pin.
4. Block diagram
VIO(1) 5 VCC 3 VCC
TJA1051
TEMPERATURE PROTECTION VIO
(1)
7 SLOPE CONTROL AND DRIVER
CANH
TXD
1
TIME-OUT
6
CANL
S
8
MODE CONTROL
RXD
4
DRIVER
2 GND
015aaa036
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC.
Fig 1.
Block diagram
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
2 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
5. Pinning information
5.1 Pinning
TJA1051T/3 TJA1051T
TXD GND VCC RXD 1 2 3 4
015aaa037
TJA1051TK/3
8 7 6 5 S CANH CANL n.c. TXD GND VCC RXD 1 2 3 4
015aaa038
8 7 6 5
S CANH CANL VIO
Fig 2.
Pin configuration diagrams
5.2 Pin description
Table 2. Symbol TXD GND VCC RXD n.c. VIO CANL CANH S Pin description Pin 1 2 3 4 5 5 6 7 8 Description transmit data input ground supply supply voltage receive data output; reads out data from the bus lines not connected; in TJA1051T version only supply voltage for I/O level adapter; in TJA1051T/3 and TJA1051TK/3 versions only LOW-level CAN bus line HIGH-level CAN bus line Silent mode control input
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
3 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
6. Functional description
The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines the functionality of the TJA1050 transceiver with improved EMC and ESD handling capability. Improved slope control and high DC handling capability on the bus pins provides additional application flexibility. The TJA1051 is available in two versions, distinguished only by the function of pin 5:
* The TJA1051T is 100 % backwards compatible with the TJA1050 * The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V
6.1 Operating modes
The TJA1051 supports two operating modes, Normal and Silent, which are selectable via pin S. See Table 3 for a description of the operating modes under normal supply conditions.
Table 3. Mode Normal Silent
[1] [2]
Operating modes Inputs Pin S LOW LOW HIGH Pin TXD LOW HIGH X[2] Outputs CAN driver dominant recessive recessive Pin RXD active[1] active[1] active[1]
LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive. X = don't care
6.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible ElectroMagnetic Emission (EME).
6.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled, releasing the bus pins to recessive state. All other IC functions, including the receiver, continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN controller from disrupting all network communications.
6.2 Fail-safe features
6.2.1 TXD dominant time-out function
A `TXD dominant time-out' timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
4 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
6.2.2 Internal biasing of TXD and S input pins
Pin TXD has an internal pull-up to VIO and pin S has an internal pull-down to GND. This ensures a safe, defined state in case one or both of these pins are left floating.
6.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus (zero load) until VCC and VIO have recovered.
6.2.4 Over-temperature protection
The output drivers are protected against over-temperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillations due to temperature drift are avoided.
6.3 VIO supply pin
Two versions of the TJA1051 are available, only differing in the function of a single pin. Pin 5 is either not connected or is a VIO supply pin. Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller supply voltage (see Figure 3). This will adjust the signal levels of pins TXD, RXD and S to the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to levels compatible with 5 V microcontrollers.
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
5 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
7. Application design-in information
BAT
3V
5V VCC CANH CANH S Pyy TX0 RX0 GND GND
015aaa039
VIO VDD
TJA1051T/3 TJA1051TK/3
CANL CANL
TXD RXD
MICROCONTROLLER
Fig 3.
Typical application of the TJA1051T/3 or TJA1051TK/3.
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Vx voltage on pin x Conditions no time limit; DC value on pins CANH and CANL on any other pin Vtrt VESD transient voltage electrostatic discharge voltage on pins CANH and CANL IEC 61000-4-2 at pins CANH and CANL HBM at pins CANH and CANL at any other pin MM at any pin CDM at corner pins at any pin Tvj Tstg Tamb
[1] [2]
[6] [5] [1] [2] [3] [4]
Min -58 -0.3 -150 -8 -8 -4 -300 -750 -500
[7]
Max +58 +7 +100 +8 +8 +4 +300 +750 +500 +150 +150 +125
Unit V V V kV kV kV V V V C C C
virtual junction temperature storage temperature ambient temperature
-40 -55 -40
Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. IEC 61000-4-2 (150 pF, 330 ).
(c) NXP B.V. 2009. All rights reserved.
TJA1051_4
Product data sheet
Rev. 04 -- 20 October 2009
6 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
[3] [4] [5] [6] [7]
ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 ) has been be verified by an external test house. The result is equal to or better than 8 kV (unaided). Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k). Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ). Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (> 1000 V). In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P x Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb).
9. Thermal characteristics
Table 5. Thermal characteristics According to IEC 60747-1. Symbol Rth(vj-a) Parameter thermal resistance from virtual junction to ambient Conditions SO8 package; in free air HVSON8 package; in free air Value 155 55 Unit K/W K/W
10. Static characteristics
Table 6. Static characteristics Tvj = -40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC[2]. Symbol VCC ICC Parameter supply voltage supply current Silent mode Normal mode recessive; VTXD =VIO dominant; VTXD = 0 V Vuvd(VCC) undervoltage detection voltage on pin VCC supply voltage on pin VIO supply current on pin VIO Normal and Silent modes recessive; VTXD = VIO dominant; VTXD = 0 V Vuvd(VIO) undervoltage detection voltage on pin VIO HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current HIGH-level input voltage LOW-level input voltage VS = VIO VS = 0 V 10 50 1.3 80 350 250 500 2.7 A A V 2.5 20 3.5 5 50 10 70 4.5 mA mA V Conditions Min 4.5 0.1 Typ 1 Max 5.5 2.5 Unit V mA Supply; pin VCC
I/O level adapter supply; pin VIO[1] VIO IIO 2.8 5.5 V
Mode control input; pin S VIH VIL IIH IIL VIH VIL
TJA1051_4
0.7VIO -0.3 1 -1 0.7VIO -0.3
4 0 -
VIO + 0.3 V 0.3VIO 10 +1 V A A
CAN transmit data input; pin TXD VIO + 0.3 V 0.3VIO V
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
7 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
Table 6. Static characteristics ...continued Tvj = -40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC[2]. Symbol IIH IIL Ci IOH IOL VO(dom) Parameter HIGH-level input current LOW-level input current input capacitance HIGH-level output current LOW-level output current dominant output voltage VRXD = VIO - 0.4 V; VIO = VCC VRXD = 0.4 V; bus dominant VTXD = 0 V; t < tto(dom)TXD pin CANH pin CANL Vdom(TX)sym transmitter dominant voltage symmetry VO(dif)bus Vdom(TX)sym = VCC - VCANH - VCANL 2.75 0.5 -400 1.5 -50 2 0.5 50 3.5 1.5 0 4.5 2.25 +400 3 +50 V V mV V mV V V mV Conditions VTXD = VIO Normal mode; VTXD = 0 V
[3]
Min -5 -260 -8 2
Typ 0 -150 5 -3 5
Max +5 -30 10 -1 12
Unit A A pF mA mA
CAN receive data output; pin RXD
Bus lines; pins CANH and CANL
bus differential output voltage VTXD = 0 V; t < tto(dom)TXD RL = 45 to 65 VTXD = VIO; recessive; no load recessive output voltage differential receiver threshold voltage Normal and Silent modes; VTXD = VIO; no load Normal and Silent modes Vcm(CAN)[4] = -30 V to +30 V
VO(rec) Vth(RX)dif Vhys(RX)dif IO(dom)
0.5VCC 3 0.7 120 0.9 200
differential receiver hysteresis Normal and Silent modes voltage Vcm(CAN) = -30 V to +30 V dominant output current VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V pin CANH; VCANH = 0 V pin CANL; VCANL = 5 V / 40 V
-100 40 -5 -5 9
-70 70 0 15 0 30 190
-40 100 +5 +5 28 +1 52 20 10 -
mA mA mA A k % k pF pF C
IO(rec) IL Ri Ri Ri(dif) Ci(cm) Ci(dif) Tj(sd)
recessive output current leakage current input resistance input resistance deviation differential input resistance common-mode input capacitance differential input capacitance shutdown junction temperature
Normal and Silent modes; VTXD = VIO VCANH = VCANL = -27 V to +32 V VCC = VIO = 0 V; VCANH = VCANL = 5 V between VCANH and VCANL
[3]
-1 19 -
[3]
Temperature protection
[3]
[1] [2]
Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC. All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 C ambient temperature (wafer level pretesting), and 100 % tested at 25 C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. Not tested in production.
(c) NXP B.V. 2009. All rights reserved.
[3]
TJA1051_4
Product data sheet
Rev. 04 -- 20 October 2009
8 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
[4]
Vcm(CAN) is the common mode voltage of CANH and CANL.
11. Dynamic characteristics
Table 7. Dynamic characteristics Tvj = -40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC.[2] Symbol td(TXD-busdom) td(TXD-busrec) td(busrec-RXD) tPD(TXD-RXD) Parameter delay time from TXD to bus dominant delay time from TXD to bus recessive delay time from bus recessive to RXD propagation delay from TXD to RXD Conditions Normal mode Normal mode Normal and Silent modes Normal and Silent modes versions with pin 5 n.c. Normal mode versions with VIO pin Normal mode tto(dom)TXD
[1] [2]
Min 40 40 0.3
Typ 65 90 60 65 1
Max 220 250 12
Unit ns ns ns ns ns ns ms
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5
td(busdom-RXD) delay time from bus dominant to RXD
TXD dominant time-out time
VTXD = 0 V; Normal mode
Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC. All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 C ambient temperature (wafer level pretesting), and 100 % tested at 25 C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range.
+5 V
47 F 100 nF
VIO(1) TXD
VCC CANH
TJA1051
RL
100 pF
RXD GND
15 pF
CANL S
015aaa040
(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3), the VIO input is connected to pin VCC.
Fig 4.
Timing test circuit for CAN transceiver
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
9 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
HIGH TXD LOW CANH
CANL dominant 0.9 V
VO(dif)(bus) 0.5 V recessive HIGH RXD 0.7VIO 0.3VIO LOW td(TXD-busdom) td(TXD-busrec) td(busdom-RXD) tPD(TXD-RXD) tPD(TXD-RXD) td(busrec-RXD)
015aaa025
Fig 5.
CAN transceiver timing diagram
12. Test information
12.1 Quality information
This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications.
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
10 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 6.
TJA1051_4
Package outline SOT96-1 (SO8)
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
11 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
X
D
B
A
E
A
A1 c
detail X terminal 1 index area terminal 1 index area 1 L K e1 e b 4 v w CAB C y1 C C y
Eh
8 Dh
5
0 Dimensions Unit(1) mm A A1 b c 0.2 D Dh E Eh e
1 scale e1 K
2 mm
L
v 0.1
w
y
y1 0.1
max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25
0.35 0.45 3.10 2.45 3.10 1.65 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.25 0.35 2.90 2.35 2.90 1.55
0.05 0.05
Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. Outline version SOT782-1 References IEC --JEDEC MO-229 JEITA --European projection
sot782-1_po
Issue date 09-08-25 09-08-28
Fig 7.
TJA1051_4
Package outline SOT782-1 (HVSON8)
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
12 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
TJA1051_4 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
13 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 8.
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
14 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
15 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
15. Revision history
Table 10. TJA1051_4 Modifications Revision history Release date 20091020 Data sheet status Product data sheet Change notice Supersedes TJA1051_3 Document ID
*
Revised parameter values in Table 4 (VESD) 20090825 20090701 20090309 Product data sheet Product data sheet Product data sheet TJA1051_2 TJA1051_1 -
TJA1051_3 TJA1051_2 TJA1051_1
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
16 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1051_4
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 -- 20 October 2009
17 of 18
NXP Semiconductors
TJA1051
High-speed CAN transceiver
18. Contents
1 2 2.1 2.2 2.3 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.3 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4 TXD dominant time-out function . . . . . . . . . . . . 4 Internal biasing of TXD and S input pins . . . . . 5 Undervoltage detection on pins VCC and VIO . . 5 Over-temperature protection. . . . . . . . . . . . . . . 5 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 10 Quality information . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Soldering of SMD packages . . . . . . . . . . . . . . 13 Introduction to soldering . . . . . . . . . . . . . . . . . 13 Wave and reflow soldering . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 October 2009 Document identifier: TJA1051_4

▲Up To Search▲

Price & Availability of TJA105109

	To Download TJA105109 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .